Infrastructure Briefing — CHIPS and Science Act signed into U.S. law
President Biden signed the CHIPS and Science Act on 9 August 2022, providing $52.7 billion in semiconductor incentives and authorizing major investments in domestic manufacturing, R&D, and workforce development.
On 9 August 2022 the United States enacted the CHIPS and Science Act, a landmark package aimed at revitalizing domestic semiconductor capacity. The law allocates $39 billion for manufacturing incentives, a 25% advanced manufacturing investment tax credit, and $13.2 billion for research and workforce programs, with guardrails restricting recipients from expanding advanced fabrication in China.
Chip designers, cloud providers, and infrastructure teams must track funding opportunities and compliance requirements, including security, supply chain assurance, and reporting commitments tied to federal incentives. The act also directs NSF and NIST to fund R&D for next-generation chips and advanced packaging, influencing hardware roadmaps and data center planning.
- White House fact sheet summarizes funding mechanisms and guardrails.
- Public Law 117-167 provides the enacted statutory text and program authorizations.
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